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1

Synthesis and characterization of gold nanoshells using poly(diallyldimethyl ammonium chloride)

Roya Ashayer, Samjid H. Mannan, Shahriar Sajjadi

Journal:

Colloids and Surfaces A: Physicochemical and Engineering Aspects

Year:

2008

Language:

english

File:

PDF, 1.98 MB

english, 2008

2

Electronics Assembly and High Temperature Reliability Using Sn-3.8Ag-0.7Cu Solder Paste With Zn Additives

Kotadia, Hiren R., Panneerselvam, Arunkumar, Sugden, Mark W., Steen, Hector, Green, Mark, Mannan, Samjid H.

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2013

Language:

english

File:

PDF, 3.35 MB

english, 2013

3

[IEEE 2007 9th Electronics Packaging Technology Conference - Singapore (2007.12.10-2007.12.12)] 2007 9th Electronics Packaging Technology Conference - Nanoparticle Enhanced Solders for High Temperature Environments

Ashayer, Roya, Mannan, Samjid H., Sajjadi, Shahriar, Clode, Mike P., Miodownik, Mark M.

Year:

2007

Language:

english

File:

PDF, 2.80 MB

english, 2007

4

Review of silver nanoparticle based die attach materials for high power/temperature applications

Paknejad, Seyed Amir, Mannan, Samjid H.

Journal:

Microelectronics Reliability

Year:

2017

Language:

english

File:

PDF, 2.77 MB

english, 2017

5

Ultra-Stable Sintered Silver Die Attach for Demanding High-Power/Temperature Applications

Paknejad, Seyed Amir, Khtatba, Khalid, Mansourian, Ali, Mannan, Samjid H.

Journal:

IEEE Transactions on Device and Materials Reliability

Year:

2017

Language:

english

File:

PDF, 856 KB

english, 2017

6

The top quark condensate

Stephen F. King, Samjid H. Mannan

Journal:

Physics Letters B

Year:

1990

Language:

english

File:

PDF, 313 KB

english, 1990

7

Quark and lepton masses in extended technicolor

Stephen F. King, Samjid H. Mannan

Journal:

Nuclear Physics B

Year:

1992

Language:

english

File:

PDF, 1.10 MB

english, 1992

8

A review: On the development of low melting temperature Pb-free solders

Kotadia, Hiren R., Howes, Philip D., Mannan, Samjid H.

Journal:

Microelectronics Reliability

Year:

2014

Language:

english

File:

PDF, 4.97 MB

english, 2014

9

[IEEE 2012 IEEE 12th International Conference on Nanotechnology (IEEE-NANO) - Birmingham, United Kingdom (2012.08.20-2012.08.23)] 2012 12th IEEE International Conference on Nanotechnology (IEEE-NANO) - Limitations of nanoparticle enhanced solder pastes for electronics assembly

Kotadia, Hiren R., Panneerselvam, Arunkumar, Green, Mark A., Mannan, Samjid H.

Year:

2012

Language:

english

File:

PDF, 1.14 MB

english, 2012

10

Dissolution of solids in contact with liquid solder

Mannan, Samjid, Clode, Michael P.

Journal:

Soldering & Surface Mount Technology

Year:

2004

Language:

english

File:

PDF, 313 KB

english, 2004

11

Semi-active suspension system simulation using Simulink

Abramov, Sergey, Mannan, Samjid, Durieux, Olivier

Journal:

International Journal of Engineering Systems Modelling and Simulation

Year:

2009

Language:

english

File:

PDF, 702 KB

english, 2009

12

Anisotropic conducting adhesives for electronic assembly

Whalley, David C., Mannan, Samjid H., Williams, David J.

Journal:

Assembly Automation

Year:

1997

Language:

english

File:

PDF, 90 KB

english, 1997

13

Investigation of a solder bumping technique for flip‐chip interconnection

Hutt, David A., Rhodes, Daniel G., Conway, Paul P., Mannan, Samjid H., Whalley, David C., Holmes, Andrew S.

Journal:

Soldering & Surface Mount Technology

Year:

2000

Language:

english

File:

PDF, 1.11 MB

english, 2000

14

Microstructural evolution of sintered silver at elevated temperatures

Paknejad, Seyed Amir, Mansourian, Ali, Greenberg, Julian, Khtatba, Khalid, Van Parijs, Linde, Mannan, Samjid H.

Journal:

Microelectronics Reliability

Year:

2016

Language:

english

File:

PDF, 1.99 MB

english, 2016

15

Synthesis of palladium nanoshell using a layer-by-layer technique

Roya Ashayer, Mark Green, Samjid H. Mannan

Journal:

Journal of Nanoparticle Research

Year:

2010

Language:

english

File:

PDF, 351 KB

english, 2010

16

Study of intermetallic crystal growth between Nb and molten 52In-48Sn solder

Samjid H. Mannan, Mike P. Clode, Mohamed Dagher

Journal:

Journal of Electronic Materials

Year:

2005

Language:

english

File:

PDF, 2.14 MB

english, 2005

17

Disabling of Nanoparticle Effects at Increased Temperature in Nanocomposite Solders

Omid Mokhtari, Ali Roshanghias, Roya Ashayer, Hiren R. Kotadia, Farzad Khomamizadeh, Amir H. Kokabi, Michael P. Clode, Mark Miodownik, Samjid H. Mannan

Journal:

Journal of Electronic Materials

Year:

2012

Language:

english

File:

PDF, 868 KB

english, 2012

18

Technicolor and the top quark condensate

Stephen F. King, Samjid H. Mannan

Journal:

Physics Letters B

Year:

1991

Language:

english

File:

PDF, 376 KB

english, 1991

19

[IEEE 2012 IEEE 12th International Conference on Nanotechnology (IEEE-NANO) - Birmingham, United Kingdom (2012.08.20-2012.08.23)] 2012 12th IEEE International Conference on Nanotechnology (IEEE-NANO) - Pressure free sintering of silver nanoparticles to silver substrate using weakly binding ligands

Durairaj, Rajkumar, Ashayer, Roya, Kotadia, Hiren R., Haria, Neil, Lorenz, Chris, Mokhtari, Omid, Mannan, Samjid H.

Year:

2012

Language:

english

File:

PDF, 1018 KB

english, 2012

20

Analysis of jamming networks in sheared suspensions

Hillman, Simon R., Mannan, Samjid H.

Journal:

Journal of Rheology

Year:

2006

Language:

english

File:

PDF, 738 KB

english, 2006

21

[IEEE High Density Packaging (ICEPT-HDP) - Shanghai, China (2011.08.8-2011.08.11)] 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging - Multi-physics computer simulation of the electromigration phenomenon

Zhu, Xiaoxin, Kotadia, Hiren, Xu, Sha, Lu, Hua, Mannan, Samjid H., Chan, Y. C., Bailey, Chris

Year:

2011

Language:

english

File:

PDF, 1.57 MB

english, 2011

22

[IEEE 2012 IEEE 62nd Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2012.05.29-2012.06.1)] 2012 IEEE 62nd Electronic Components and Technology Conference - Remedies to control electromigration: Effects of CNT doped Sn-Ag-Cu interconnects

Xu, Sha, Zhu, Xiaoxin, Kotadia, Hiren, Lu, Hua, Mannan, Samjid H., Bailey, Chris, Chan, Y C

Year:

2012

Language:

english

File:

PDF, 538 KB

english, 2012

23

[IEEE 2007 9th Electronics Packaging Technology Conference - Singapore (2007.12.10-2007.12.12)] 2007 9th Electronics Packaging Technology Conference - Failure Mechanisms of Dummy IGBT Assembles Constructed using Liquid In-Sn/Nb System

Li, Jianfeng, Sarvar, Farhad, Whalley, David. C., Hutt, David A., Clode, Mike P., Mannan, Samjid H.

Year:

2007

Language:

english

File:

PDF, 1.10 MB

english, 2007

24

THE TOP QUARK CONDENSATE IN THE PRESENCE OF HIGHER-DIMENSIONAL OPERATORS

MANNAN, SAMJID H., KING, STEPHEN F.

Journal:

International Journal of Modern Physics A

Year:

1991

Language:

english

File:

PDF, 255 KB

english, 1991

25

CONFERENCE REPORT ON THE 1995 JAPAN INTERNATIONAL ELECTRONIC MANUFACTURING TECHNOLOGY SYMPOSIUM

MANNAN, SAMJID H.

Journal:

Journal of Electronics Manufacturing

Year:

1996

File:

PDF, 156 KB

1996

26

Thermally stable high temperature die attach solution

Amir Paknejad, S., Mansourian, Ali, Noh, Yohan, Khtatba, Khalid, Mannan, Samjid H.

Journal:

Materials & Design

Year:

2015

Language:

english

File:

PDF, 1.30 MB

english, 2015

27

SPIE Proceedings [SPIE SPIE Photonics Europe - Brussels, Belgium (Monday 12 April 2010)] Optical Sensing and Detection - Assessment and development of novel transition metal oxide materials as a photovoltaic sensor

Subahi, Ahmad M., Berghmans, Francis, Mignani, Anna G., Griffiths, Jennifer A., Mannan, Samjid, van Hoof, Chris A., Boardman, Jeffery, Moir-Riches, Paul, Royle, Gary J.

Year:

2010

Language:

english

File:

PDF, 487 KB

english, 2010

28

Anisotropic conducting adhesives for electronic assembly

Whalley, David C., Mannan, Samjid H., Williams, David J.

Journal:

Microelectronics International

Year:

1999

Language:

english

File:

PDF, 132 KB

english, 1999

29

Stereoscopic Nanoscale-Precision Growth of Free-Standing Silver Nanorods by Electron Beam Irradiation

Mansourian, Ali, Paknejad, Seyed Amir, Zayats, Anatoly V, Mannan, Samjid H.

Journal:

The Journal of Physical Chemistry C

Year:

2016

Language:

english

File:

PDF, 2.42 MB

english, 2016

30

Modeling Electromigration for Microelectronics Design

ZHU, Xiao, KOTADIA, Hiren, XU, Sha, LU, Hua, MANNAN, Samjid, BAILEY, Chris, CHAN, Yancheong

Journal:

Journal of Computational Science and Technology

Year:

2013

Language:

english

File:

PDF, 2.24 MB

english, 2013

31

Tunable Ultra-high Aspect Ratio Nanorod Architectures grown on Porous Substrate via Electromigration

Mansourian, Ali, Paknejad, Seyed Amir, Wen, Qiannan, Vizcay-Barrena, Gema, Fleck, Roland A., Zayats, Anatoly V., Mannan, Samjid H.

Journal:

Scientific Reports

Year:

2016

Language:

english

File:

PDF, 1.80 MB

english, 2016

32

Reactions in Electrodeposited Cu/Sn and Cu/Ni/Sn Nanoscale Multilayers for Interconnects

Chia, Pay, Haseeb, A., Mannan, Samjid

Journal:

Year:

2016

Language:

english

File:

PDF, 5.48 MB

english, 2016

33

Arresting high-temperature microstructural evolution inside sintered silver

Khtatba, Khalid, Paknejad, Seyed Amir, Al Zoubi, Tariq, Qutaish, Hamzeh, Sano, Naoko, Mannan, Samjid H.

Journal:

Journal of Materials Science: Materials in Electronics

Year:

2018

Language:

english

File:

PDF, 2.39 MB

english, 2018

34

High bond strength Cu joints fabricated by rapid and pressureless in situ reduction-sintering of Cu nanoparticles

Zuo, Yang, Carter-Searjeant, Sadie, Green, Mark, Mills, Liam, Mannan, Samjid H.

Journal:

Materials Letters

Year:

2020

File:

PDF, 619 KB

2020

35

Low temperature Cu joining by in situ reduction-sintering of CuO nanoparticle for high power electronics

Zuo, Yang, Carter-Searjeant, Sadie, Green, Mark, Mills, Liam, Mannan, Samjid H.

Journal:

Advanced Powder Technology

Year:

2020

File:

PDF, 312 KB

2020